The demand for chips in high-performance computing (HPC), AI, electric vehicles, and aerospace and defense industries has grown significantly.

As chip performance increases, it generates high heat or requires quality testing under ultra-low temperature conditions, necessitating the design of more energy-efficient, environmentally friendly, and highly effective extreme temperature testing equipment.

After years of exploration and research, YISHI has successfully developed energy-efficient, nitrogen-free, ultra-low temperature (-80°C), condensation-free, and non-contact cooling technology that can rapidly remove high heat generated during chip testing.

For these technologies, YISHI has applied for over 12 patents to ensure autonomous and controllable intellectual property rights.